Capabilities

ENGINEERING:

Design
Layout
Dxf to gerber
Gerber to Dxf
Reverse engineering
Panelization
Paste File

BOARD TYPE:

Single sided
Double Sided
Multi-layers
Thru Holes and Surface Mount

MATERIALS:

FR4 (TG of 170/180+)
GETEK
CEM-1
CEM-3
ARLON
TACONIC
ROGERS
TEFLON laminate circuit boards for RF and microwave industries.
COMPOSITE multi layers
ALUMINUM backed single layers boards for LED lighting industry
CONDUCTIVE bonding of any printed circuit boards to aluminum, brass, and copper machined carriers and housings.
ANTENNA’s (Large communication, conical, cylindrical, conformal multi layers and geometric).
CERAMIC substrate circuitry